S. Yoshimoto, T. Uemura, M. Akiyama, Y. Ihara, S. Otake, T. Fujii, T. Araki, , and T. Sekitani, "Flexible Organic Tft Bio-Signal Amplifier Using Reliable Chip Component Assembly Process with Conductive Adhesive," IEEE Engineering in Medicine and Biology Society, pp. 1849 -1852, Jeju Island, Korea, July 2017.
ID 1043
分類 国際会議(プロシーディングス)
タグ adhesive amplifier assembly bio-signal chip component conductive flexible organic process reliable tft
表題 (title) Flexible Organic Tft Bio-Signal Amplifier Using Reliable Chip Component Assembly Process with Conductive Adhesive
表題 (英文)
著者名 (author) Shusuke Yoshimoto, Takafumi Uemura, Mihoko Akiyama, Yoshihiro Ihara, Satoshi Otake, Tomoharu Fujii, Teppei Araki,,Tsuyoshi Sekitani
英文著者名 (author) Shusuke Yoshimoto, Takafumi Uemura, Mihoko Akiyama, Yoshihiro Ihara, Satoshi Otake, Tomoharu Fujii, Teppei Araki,,Tsuyoshi Sekitani
キー (key) Shusuke Yoshimoto, Takafumi Uemura, Mihoko Akiyama, Yoshihiro Ihara, Satoshi Otake, Tomoharu Fujii, Teppei Araki,,Tsuyoshi Sekitani
定期刊行物名 (journal) IEEE Engineering in Medicine and Biology Society, pp. 1849 -1852, Jeju Island, Korea
定期刊行物名 (英文)
巻数 (volume)
号数 (number)
ページ範囲 (pages)
刊行月 (month) 7
出版年 (year) 2017
Impact Factor (JCR)
URL https://embc.embs.org/2017/
付加情報 (note)
注釈 (annote)
内容梗概 (abstract)
論文電子ファイル 利用できません．
BiBTeXエントリ 
@article{id1043,
         title = {Flexible Organic TFT Bio-Signal Amplifier using Reliable Chip Component Assembly Process with Conductive Adhesive},
        author = {Shusuke Yoshimoto and  Takafumi Uemura and  Mihoko Akiyama and  Yoshihiro Ihara and  Satoshi Otake and  Tomoharu Fujii and  Teppei Araki and  and Tsuyoshi Sekitani},
       journal = {IEEE Engineering in Medicine and Biology Society, pp. 1849 -1852, Jeju Island, Korea},
         month = {7},
          year = {2017},
}